Articles from Mixx Technologies, Inc.

Mixx Technologies, Inc., a pioneer in next-generation optical interconnect solutions, today announced its Advanced 3DS Platform, an ultra-efficient connectivity fabric that is redefining AI and high-performance computing (HPC) infrastructure. The platform includes an intelligent Engine that unifies compute, memory and network to unleash unparallelled AI performance; a Package that integrates Mixx Technologies’ Engine with core ASICs to ignite a new era of intelligence by powering super XPUs with lightning-fast connectivity; and a System comprised of exaflop scale computing with petabit end-to-end connectivity to transform rack scale compute into the future. Mixx Technologies’ Advanced Platform will be on display this week at the OFC 2025 Conference on April 1-3, 2025 at the Moscone Center in San Francisco in two locations – the Corning booth (#1643) and the US Conec booth (#1443). More information can be found here.